Recently, the Shenzhen Development and Reform Commission released the "Shenzhen Measures to Promote the High Quality Development of the Semiconductor and Integrated Circuit Industry (Draft for Comments)" (hereinafter referred to as the "Draft for Comments").

The Draft proposes to focus on supporting the design of high-end general-purpose chips, special-purpose chips, core chips, compound semiconductor chips and other chips; Silicon based integrated circuit manufacturing; Gallium nitride, silicon carbide and other compound semiconductor manufacturing; Manufacturing of high-end electronic components; Advanced packaging and testing technologies such as wafer level packaging, 3D packaging, and chiplet; Development and application of EDA tools and key IP core technologies; Advanced equipment such as photolithography, etching, ion implantation, deposition, testing equipment, production of key components, and R&D and industrialization of core semiconductor materials.

In addition, the Draft clearly proposes to comprehensively improve the core links of the industrial chain, accelerate the breakthrough of basic support links, enhance the momentum of industrial development, and build a high-quality talent security system.

Comprehensively improve the core links of the industrial chain

To achieve breakthroughs in core chip products, it is necessary to achieve breakthroughs in CPU, GPU, DSP, FPGA and other high-end general chips, artificial intelligence chips, edge computing chips and other special chips, RF front-end chips, baseband chips, optoelectronic chips and other core chip products, with a maximum reward of 10 million yuan.

We will strengthen support for design enterprises to make films, support integrated circuit design enterprises to increase research and development of new products, focus on supporting integrated circuit design enterprises to make films and masks, and grant subsidies with a maximum annual total amount of no more than 7 million yuan.

Improve semiconductor manufacturing capacity, strengthen cooperation with integrated circuit manufacturers, plan and build integrated circuit production lines with logic process and characteristic process, and support the construction of high-end chip capacitors, inductors, resistors and other electronic components production lines. Support the settlement of major semiconductor and integrated circuit manufacturing projects that represent new development directions, and encourage the transformation and upgrading of existing integrated circuit production lines.

Catch up with and surpass the high-end packaging and testing level: accelerate the R&D and industrialization of power devices such as MOSFET modules and high-density memory packaging technologies, and focus on breakthroughs in advanced packaging core technologies such as wafer level, system level, bump, flip chip, silicon through-hole, panel level fan out, 3D, vacuum, chiplet (core), as well as advanced wafer level testing technologies such as pulse sequence testing, IC integrated probe card, A subsidy of no more than 10 million yuan will be given for a single project.

Accelerate breakthroughs in basic support links

Accelerate the tackling of EDA core technologies. Promote the localization of EDA tool software such as analog, digital and RF integrated circuits in the whole process. Support the development of EDA technologies such as advanced process, new generation intelligence and ultra-low power consumption. Increase the promotion and application of domestic EDA tools, encourage enterprises and scientific research institutions to purchase or rent domestic EDA tool software, and promote domestic EDA tools to enter college curriculum teaching. The maximum subsidy is 10 million yuan per year.

Promote the independence and controllability of key materials. Relying on key enterprises, we will accelerate the R&D and production of semiconductor materials such as photomask, photoresist, polyimide, sputtering target, high-purity chemical reagent, electronic gas, etching solution, cleaning agent, polishing solution, functional additive of electroplating solution, fluorinated coolant, ceramic powder, etc. Up to 20 million yuan can be awarded.

Breakthrough in supporting core equipment and parts. Encourage Shenzhen enterprises to carry out research and development of key integrated circuit equipment and components, promote the integration of high-end equipment components and systems, such as testing equipment, film deposition equipment, etching equipment, cleaning equipment, high vacuum pumps, and carry out continuous research and development and technical breakthrough, and support the first set of key equipment and components to enter the supply chain of key integrated circuit manufacturers. A one-time settlement award of no more than 30 million yuan will be given at most.

We will increase support for tackling key core technologies. Further enhance the core competitiveness of Shenzhen's integrated circuit industry, enhance the overall independent innovation capability of the industry, break the situation where major key core technologies are under the control of others, and subsidize key technology breakthroughs in key areas, priority themes, and key projects of Shenzhen's integrated circuit industry. Guide enterprises to increase R&D investment.