Recently, Xi'an Municipal People's Government issued the "Fourteenth Five Year" Industrial and Informatization Development Plan of Xi'an (hereinafter referred to as the "Development Plan"), which clearly proposed the main tasks, development direction and development priorities of the electronic information manufacturing industry during the "Fourteenth Five Year" period. Samsung, Micron, Huatian Science and Technology, Yi Siwei and other semiconductor enterprises were mentioned.

1） Main tasks

Implement the "double" plan for pillar industries, rely on 12 leading backbone enterprises such as Samsung, ZTE, BYD Electronics, Skyworth, etc., and take the promotion of key industrial chains such as photons, semiconductors and integrated circuits, intelligent terminals, sensors, etc. as the traction;

With the support of key projects such as Samsung flash memory chips, Iswell Silicon Industrial Base, BYD high-end intelligent terminal industrial park project, Skyworth smart home production base, "the Belt and Road" port industrial park, etc., we will build an electronic information manufacturing industrial cluster and realize the doubling of industrial scale. By 2025, the output value will reach 350 billion yuan, with an average annual growth rate of 22.2%.

2） Development direction

Integrated circuit: layout the third generation semiconductor production line, focus on introducing 8/12 inch silicon substrate production line, plan to introduce 6 inch SiC substrate and 8 inch Si based GaN epitaxial film production line, and introduce material enterprises and equipment manufacturers such as photomask, high-purity sputtering target, wet electronic chemicals, special gases, sealing materials and equipment, etching equipment, film deposition equipment, etc.

Smart terminals: take the whole machine manufacturing as the traction, improve the design and research capabilities of smart phones, expand the scale of smart phone industry, and strengthen the supporting capabilities of special chips, high-end chassis, display screens, power supplies, camera modules, basic components, etc. Focus on the development of service robots for home applications, extend the development of industrial robots and special robots for intelligent manufacturing, special operations and other applications, improve the capacity of independent research and development and mass production of intelligent robots, and improve key parts, control systems, integrated applications and other supporting facilities.

Electronic components: promote the transformation and upgrading of basic components such as electronic vacuum tubes, connectors, inductors, capacitors, optical fiber cables, electronic instruments and meters, accelerate the evolution of electronic components to chip, ultra micro, digital, intelligent and green, and accelerate the R&D and industrialization of new electronic components such as new sensitive components, new electroacoustic components, flexible circuit boards, and new displays.

3） Development priorities

In the aspect of integrated circuit, we will rely on Samsung, Micron, Huatian, Yi Siwei and other enterprises, give full play to the role of Shaanxi Semiconductor Pilot Technology Center and other professional institutions, and actively develop the R&D and production of integrated circuit equipment and materials, integrated circuit manufacturing, packaging and testing industries.

Relying on Xi'an CRESS, Ziguang Guoxin, Xiyue Electronics, Yuanjie Semiconductor and other enterprises, accelerate the design and industrialization of special chips for network communication, memory, sensors, the Internet of Things, and continue to improve the scale and level of Xi'an integrated circuit design.

Integrate the resources of existing research institutes and universities, cooperate with chip design and manufacturing enterprises, and actively promote the R&D and industrialization of the third generation semiconductor technologies such as SiC and GaN.

In the field of intelligent terminals, relying on BYD Electronics, ZTE, Skyworth, Huaqin and other enterprises, we will actively introduce key chips, cameras, antennas, touch panels and other related supporting enterprises, expand the scale of the intelligent terminal industry, and accelerate the construction of a more complete intelligent terminal industry chain supply chain.

Give play to the R&D advantages of Huawei's Xi'an R&D Center, accelerate the R&D of core technologies and products of smart terminals, and develop new generation smart phones, wearable devices, on-board smart devices, home smart terminals, virtual reality devices and other smart terminal products and devices.

In terms of electronic components, relying on Xijing, Xi'an Juguang, Xi'an Perui, AVIC Fujita and other enterprises, we will vigorously develop core basic components that meet the needs of high-end equipment, applied electronics, the Internet of Things, new energy vehicles, and new generation information technology.

Break through the key common technologies such as micro structure processing and high-density packaging of MEMS, accelerate the development and industrialization of sensor products, develop the next generation of power electronic devices, and support the promotion and application of typical fields.

Accelerate the research and development of new electrical connectors and millimeter wave RF coaxial connectors for mobile terminals, and realize industrialization as soon as possible.