Recently, another batch of semiconductor projects in China have made new progress, involving IGBT, silicon carbide, gallium nitride, MLCC, semiconductor equipment and other fields.

1、 Multiple projects started

one

Intelligent manufacturing base project of semiconductor packaging and testing equipment

According to the news released by Suzhou High-tech Zone, on January 11, the project of the R&D and production headquarters and the intelligent manufacturing base for semiconductor packaging and testing equipment of Saten Electronics was started, which will become the headquarters and intelligent manufacturing base integrating R&D and production.

In 2006, Saten Electronics officially settled in Suzhou High-tech Zone, and has been committed to the R&D and production of optical modules, semiconductor probes and other components of optical communication. It is a high-precision product manufacturing enterprise.

The total construction area of the project of the R&D and production headquarters and intelligent manufacturing base for semiconductor packaging and testing equipment of Sudden Electronics is more than 40000 square meters. After completion, it will become the headquarters and intelligent manufacturing base integrating R&D and production. It is planned to mass produce semiconductor packaging and testing equipment, automobile modules, optical modules and other projects.

two

People's Holding High-end Silicon-based Chip Packaging Project

According to the news released by Tinghu, on January 10, Yancheng City, Jiangsu Province, held the promotion activity of high-quality development industrial projects, and started and signed 22 industrial projects, including the People's Holding high-end silicon-based chip packaging project.

The People's Holding High-end Silicon-based Chip Packaging Project is invested and constructed by the People's Holding Group, with a total investment of 900 million yuan and a planned investment of 300 million yuan in 2023. The project covers an area of 144 mu, with a new production plant and auxiliary facilities of about 128000 square meters, the purchase of 2000 sets of production equipment, and the construction of high-end silicon-based and silicon carbide chip packaging production lines. After the project is completed and put into operation, it can produce 1.2 million pieces of 6-inch high-end silicon-based wafers and 4.8 billion pieces of IC seals annually.

three

"Samsung Semiconductor Memory Chip" and other projects

According to Phoenix Jiangsu News, on January 3, the centralized commencement ceremony of major projects in the first quarter of 2023 in Suzhou Industrial Park was held.

The 49 industrial projects to be started this time include SEW-motor intelligent manufacturing project, Samsung semiconductor storage chip project, Keyang semiconductor advanced packaging project, Liandong U Valley project, Guangge headquarters building project, Tianchen International Medical Headquarters base project, Symantec technology headquarters project, Yuanzhuo photoelectric headquarters project, etc.

It is understood that in the first quarter of this year, there were 89 projects in Suzhou Industrial Park, with a total investment of 55.7 billion yuan and an annual planned investment of 20.1 billion yuan, covering new generation of information technology, high-end equipment manufacturing, biological medicine, modern service industry and other industrial projects.

four

Oknetic wafer expansion project, a subsidiary of Shanghai Silicon Industry

According to foreign media reports, the silicon wafer manufacturing project of OKMEIC, a subsidiary of Shanghai Silicon Industry, in Vantaa, Finland, has recently broken ground.

According to the previous report, the total investment of the project is about 400 million euros, and a 200 mm characteristic silicon wafer factory will be built. Oknetic is now the seventh largest silicon wafer manufacturer in the world, specializing in the production of characteristic process silicon wafers for manufacturing MEMS, sensors, RF filters and power semiconductors. The company was acquired by Chinese investors in 2016 and announced its expansion plan in May last year.

At present, Oketic has about 600 employees, and its net sales in 2021 is 128 million euros. The investment budget for new projects is about three times its annual sales. The company plans to hire another 500 new employees in the next few years. It is expected that the new project will start production in 2025 to further consolidate its market position in high-end segments such as advanced sensors, power devices, RF filters and integrated passive devices.

five

Essay Silicon and Silicon Carbide Parts Project

On January 6, the first batch of major industrial projects in Chongqing Liangjiang New Area in 2023 were officially held. In this commencement activity, a total of 17 projects were started collectively, with a total investment of 36.97 billion yuan. The projects covered advanced manufacturing, modern service industry, scientific and technological innovation and transformation and other fields.

Among them, the Essay Silicon and Silicon Carbide Component Project is invested by Beijing Essay Technology Group Co., Ltd. (hereinafter referred to as "Essay Group"), and will build a production plant with a capacity of 30000 silicon and silicon carbide components per month.

Easway Group is a product and service provider in the field of integrated circuits. Its core business covers three areas: chips and solutions, silicon materials, and ecological chain investment incubation.

The Essay Silicon and Silicon Carbide Component Project is the first cooperation between Essay Group and Chongqing. The silicon ring and silicon carbide ring products produced by the project are necessary consumables in the wafer manufacturing process, especially the silicon carbide ring products fill the gap in this field in China, which is of great significance for the new area to build the semiconductor industry highland in the southwest region.

2、 Signing and landing of five projects

one

20 photoelectric semiconductor production lines

According to the news released by Ejin Horo, the signing ceremony between the People's Government of Ejin Horo Banner and Beijing Yutai Fanglue Technology Co., Ltd. was held on January 10, and the two sides will carry out cooperation in optoelectronic semiconductor projects.

The project will be constructed in Mengsu Economic Development Zone. It is planned to introduce 20 internationally advanced optoelectronic semiconductor production lines. It is estimated that the total investment of the project will be 800 million yuan, and it has the ability to produce 1 billion optoelectronic semiconductor chips of various types annually.

two

Hefei Institute of Innovation, Beijing University of Aeronautics and Astronautics

According to the information released by Hefei Municipal People's Government, on January 4, the project of Hefei Innovation Research Institute of Beijing University of Aeronautics and Astronautics was officially signed in Hefei.

The project is based on the construction of the Beihang Innovation Institute, focusing on unmanned driving, electromagnetic compatibility and integrated circuits, focusing on the construction of pilot test bases to promote the transformation and upgrading of local industries, demonstration bases for the transfer and transformation of Beihang scientific research achievements, and training bases for local industries in urgent need of applied talents, and building high-end talent introduction platforms and high-energy sharing application platforms.

three

Taijing Micro Semiconductor Project was signed and settled in Jiangsu

According to the Changshu National High-tech Zone, on January 6, the Taijing Micro Semiconductor Project was signed and settled in Changshu High-tech Zone.

The total investment of the first phase of the Taijing Micro Semiconductor Project is 500 million yuan, with an annual output of 1.5 million sets of power semiconductor modules, and an annual output value of more than 1 billion yuan after reaching the production capacity. The company integrates overseas technologies and plans to invest in the establishment of the company headquarters in Changshu High-tech Zone, together with the construction of the power semiconductor module production base. The main products include highly reliable Sic MOS, IGBT modules, and drive circuit modules used in the new energy and industrial fields Protection circuit module, etc.

According to the official website, Suzhou Taijing Micro Semiconductor is a high-tech company focusing on silicon carbide (SiC) and IGBT semiconductors. It was founded in Suzhou in 2020. Its main products include high reliability SiC, IGBT modules and Mosfet devices for new energy and industrial use. The products are applied to new energy vehicles, smart grids, renewable energy, industrial motor drives, medical devices, power supplies and other scenarios and fields.

four

Implementation of the third generation semiconductor project of Gejing Semiconductor

On January 5, the People's Government of Wannian County, Shangrao City, Jiangxi Province and Shanghai Gejing Semiconductor Co., Ltd. (hereinafter referred to as "Gejing Semiconductor") held a cooperation signing ceremony.

The total investment of the third generation semiconductor industrialization project signed this time is up to 2.5 billion yuan. The main customers of the products are Huawei Hisense, Xiaomi, VIVO, OPPO and other mobile phone manufacturers, and ZTE base station, CETC military radar, Geely car fast charging, etc.

After the project is put into production, it can achieve an annual output of 50000 8-inch GAN power devices, and become the first and second wafer factory in Jiangxi Province to mass produce GaN on-board power devices in China. The project is expected to be IPO in 2026.

five

The project of 100000 tons of high-purity silicon-based materials and 20000 tons of semiconductor silicon-based materials was signed

On January 1, the People's Government of Jiuyuan District and Xinjiang Daquan New Energy Co., Ltd. held the signing ceremony of the investment agreement for the project of producing 100000 tons of high-purity silicon-based materials and 20000 tons of semiconductor silicon-based materials annually.

According to the agreement, Xinjiang Daquan New Energy Co., Ltd. will continue to invest in the construction of "100000 tons/year high-purity silicon-based material project+20000 tons/year semi-conductor silicon-based material project" in Jiuyuan District on the basis of the first-phase project "100000 tons/year high-purity polysilicon+1000 tons/year semiconductor polysilicon project", and jointly build the world's most competitive high-purity silicon production enterprise and new energy base.

The project covers a total area of 1500 mu, with a total investment of 17.3 billion yuan. It is expected to start construction in the first quarter of 2023 and be completed and put into operation by the end of 2023. The project is expected to have an annual output value of 15.1 billion yuan, a profit of 8 billion yuan and a tax of 2.5 billion yuan.

3、 Several projects have been put into operation and completed

one

Anhui Lanxun Communication Project was put into operation

According to the Lujiang government website, the launch ceremony of Anhui Lanxun Communication Project was held in Lujiang High-tech Zone on January 9.

Anhui Lanxun Communication Project was signed and settled in Lujiang High-tech Zone on January 18, 2022. Construction began on July 7, the main structure was capped on August 19, and the equipment entered the site in October.

Anhui Lanxun Lujiang Project has a total investment of 2.008 billion yuan. The project will be constructed in two phases. The new production line of RF functional devices, substrates, RF system modules and ceramic functional materials will be installed. The whole project will be completed and put into operation, and the annual output value is expected to reach 5 billion yuan.

two

The monthly production capacity of Xianghe MLCC Project Phase I is 5 billion and has reached the production capacity

On January 8, Fenghua Hi-Tech said on the investor interaction platform that the company had decided to increase its fund-raising investment projects as "the construction project of high-end capacitor base in Xianghe Industrial Park" and "the technical transformation and expansion project of new chip resistors with a monthly output of 28 billion".

Among them, Xianghe Project plans to increase the monthly capacity of MLCC by 45 billion, and the current monthly capacity of Phase I is 5 billion. The company will closely combine the industry development trend and market conditions to promote the project capacity construction; The resistance project plans to increase the monthly capacity of chip resistors by 28 billion. At present, the project construction has met the design capacity planning requirements.

It is understood that high-end products of Fenghua Hi-Tech MLCC mainly include high-capacity, high-voltage, safety regulation, high reliability and vehicle regulation products, and high-end products of chip resistor mainly include vehicle regulation resistance, film resistance, vulcanization resistance, alloy resistance, etc.

three

The project of "development of electronic components in 2022" was launched

On January 8, Dali Science and Technology announced that recently, the company received the starting fund of the "2022 electronic component development" project issued by the central finance, with the amount of 3.2 million yuan, marking that the company has officially won the sample project and has entered the implementation stage. Up to now, the company has received 3.2 million yuan of the project funds.

According to the announcement, the development content of this project is related to the vanadium oxide technical route in the field of uncooled infrared focal plane detectors and the realization of industrialization. In the early stage, after the expert review and publicity organized by a certain department, the company took the task of winning the bid with the first total score of the review. This project is the first time that the company has undertaken the research and development tasks related to the vanadium oxide technology route after undertaking the major special project of the amorphous silicon technology route for many years in succession, marking that the company's research achievements related to the vanadium oxide technology route have been recognized by the state.

Dali Technology has achieved the mass production of uncooled infrared focal plane detectors with the only dual-technology route (amorphous silicon and vanadium oxide) in China in 2021. The parallel development of amorphous silicon and vanadium oxide technology routes is conducive to consolidating the company's leading position in the development and industrialization of uncooled infrared focal plane devices, the core chip of infrared thermal imaging.

Dali Technology said that after the successful implementation of the project, it will help improve China's competitiveness in the field of infrared thermal imaging core chips and equipment, and also help the company's business development of infrared complete machine and photoelectric system, which has long-term strategic significance for the company's development. Subsequently, the company will carry out work in strict accordance with the relevant regulations and requirements of the project management party.

four

Pingmei Shenma Silicon Carbide Semiconductor Chip Material Successfully Offline

According to the Henan Daily, on January 4, the silicon carbide semiconductor chip materials - silicon carbide high-purity powder and silicon carbide ingot produced by China Pingmei Shenma Group successfully went offline, and the product quality reached the domestic first-class level.

In 2022, China Pingmei Shenma Group invested 70 million yuan to launch the development project of silicon carbide based semiconductor material demonstration line, mainly developing and producing the third generation of semiconductor silicon carbide powder and silicon carbide substrate materials, and creating a "test field" of chip material industry with a level of 100 billion.

According to the report, the project gathers the industrial advantages of China Pingmei Shenma Group. The upstream uses the advantages of coal and coke oven gas to prepare high-purity hydrogen, needle coke, electronic silicon, zone melting silicon and other raw materials, and the downstream connects with the energy storage lithium battery and photovoltaic industries. It can quickly form the national and even the world's leading high-quality industrial chain of "coal - hydrogen - needle coke - high-purity silane - silicon carbide - silicon carbide semiconductor - energy storage lithium battery and photovoltaic".

five

Best Star GaN semiconductor chip project completed

According to the news of Panjin High-tech Industrial Development Zone on January 4, at present, the GaN semiconductor chip project of Liaoning Best Semiconductor Technology Co., Ltd. (hereinafter referred to as "Best") has entered the stage of product trial production.

Best Star is a comprehensive high-tech enterprise integrating research and development, design, production, sales and service. It is always committed to creating a new scientific and technological pattern in the field of semiconductor GaN chips in China.

The GaN semiconductor chip project invested 300 million yuan by Best Tech covers an area of 125 mu and a total construction area of 51302.28 square meters, including 2 GaN epitaxial wafer and chip production workshops, 1 chip packaging and application product production and manufacturing workshop, 1 finished product warehouse, 1 hydrogen production station, 1 R&D center and comprehensive management room.

In the middle of December 2022, the GaN semiconductor chip project was fully completed and put into operation. After the commissioning of the factory power equipment, including power equipment system, water equipment system, gasification equipment system, FFU system, and the first, second, and third stage commissioning of a series of production equipment, such as MOCVD, oven, etc., were completed, the product trial production began.

It is reported that the completion and production of the GaN semiconductor chip project can add 10 GaN epitaxial production lines for Best Star, and achieve an annual output of 100000 GaN epitaxial chips and 1 billion GaN chips.

six

Corvette semiconductor project is put into operation

According to Ruixin Semiconductor, on January 9, the smart terminal product and module project of Keruite Semiconductor Technology was put into production.

With a total investment of US $500 million, the Corvette semiconductor project integrates the R&D, design, manufacturing, packaging and testing of smart terminal products, which are widely used in high-end application markets such as automotive electronics, industrial control, power management, smart terminals, rail transit, smart grid, etc.

The project is planned and designed in strict accordance with the requirements of vehicle-level chips. At present, more than 1300 sets of various production equipment have been put in place, and more than 3000 sets of various equipment are planned to be put into use after completion. The smooth operation of the project will drive more upstream and downstream enterprises such as IC design, chip and packaging to gather and settle down, and will create a new integrated circuit industry chain.

According to the official website, in April 2021, Shandong Ruixin Semiconductor Technology Co., Ltd., invested and established by Keruite Holdings (Shandong) Co., Ltd., is an integrated circuit manufacturing and technical service provider, providing a comprehensive one-stop service for wafer chip manufacturing, including integrated circuit system integration, R&D design, technical development, product certification, wafer mid-test, wafer level mid-channel packaging test, system-level packaging test Chip finished product testing and can provide direct shipment services to semiconductor customers around the world.

seven

Capping of the main structure of Xinyuan micro-port project

On January 11, 2023, the main structure of the core source micro-port R&D and industrialization project was capped. The project was officially started in August 2022, and the capping of the main structure was completed ahead of schedule.

In 2021, Shanghai Xinyuan Micro, a wholly-owned subsidiary of Shenyang Xinyuan Micro, was registered and established, and the "Xinyuan Micro Port R&D and Industrialization" project was officially established. The project is located in the heavy equipment industrial zone of the new area near the port, covering an area of 45 mu,