Recently, many projects in the Semiconductor industry have seen the latest progress, covering semiconductor materials, packaging, design, manufacturing, equipment, power semiconductors, third-generation semiconductors, etc.

With a total investment of 3 billion yuan, signed a contract with Xingda Semiconductor Packaging Project in Kunshan, Jiangsu

On June 7, 2023 Kunshan City (Shenzhen) Investment Promotion Conference was held, during which, Xingda Semiconductor Packaging Project was signed and settled in Kunshan, Jiangsu Province.

According to the news of "Golden Bump", Shenzhen Tongxing Xingda Technology Co., Ltd. plans to cooperate with SunMoon (Kunshan) Semiconductor Co., Ltd. in Qiandeng to invest in the construction of Gold Bump sealing and testing factory with advanced packaging technology. The products are applied to the external connection of Integrated circuit packaging technology and optoelectronic components, which is an important part of the integrated circuit industry.

The project is expected to have a total investment of 3 billion yuan, with a total investment of 980 million yuan in the first phase. The expected output value after production is 3.2 billion yuan, and the expected output value of the first phase is 900 million yuan. The production scale of the gold convex block will be in a leading position in the country.

The main structure of the 5.8 billion yuan wide core semiconductor packaging substrate project has been capped

Recently, according to news from Guda Building Materials, there has been new progress in the Guangxin semiconductor packaging substrate project. At present, the main structure of the factory building and supporting facilities of the project has been capped, and the construction of related auxiliary projects is being completed.

It is reported that the Guangxin Semiconductor Packaging Substrate Product Manufacturing Project is invested and constructed by Guangzhou Guangxin Packaging Substrate Co., Ltd., with a total investment of approximately 5.8 billion yuan, a land area of approximately 140000 square meters, and a total construction area of approximately 380000 square meters. After the project is put into operation, it is expected to produce 1.5 million PNL of semiconductor packaging substrates, 200 million pieces of semiconductor high-order flip chip packaging substrates, and 1.5 million PNL of semiconductor multi chip stacked large-size packaging substrates annually, with an annual output value of 5.6 billion yuan.

According to Tianyancha, Guangzhou Guangxin Packaging Substrate Co., Ltd. was established on August 12, 2021 with a registered capital of 150 million RMB. Its business scope includes: research and development of electronic specialized materials, sales of electronic specialized materials, manufacturing of electronic specialized materials, manufacturing of electronic components, sales of electronic components and electromechanical component equipment, sales of integrated circuit chips and products, etc.

Zhongdian Compound Semiconductor Expansion Project or Production in September

Recently, according to a news release from Qianwan New Area in Ningbo, the expansion project of Zhongdian Compound Semiconductor is planned to complete the factory decoration and put into operation in September this year.

According to the public data, CEC Compound was founded in November 2019 and invested by Huada Semiconductor Co., Ltd., a subsidiary of China Electronics Corporation. According to the Ningbo Municipal People's Government, Zhongdian Compound is the first third-generation semiconductor project in Zhejiang Province.

According to the official website of Zhongdian Compound, the company mainly focuses on the research and development, production, and sales of large-sized and high-performance silicon carbide materials and gallium nitride epitaxial materials. It has built a modern production workshop in the Ningbo Qianwan New Area Digital Economy Industrial Park, which includes silicon carbide substrates, silicon carbide epitaxial materials, and gallium nitride epitaxial materials. The company supplies commercial 4-6 inch SiC and GaN materials to domestic and foreign markets, and the products can be widely used in electric vehicles, photovoltaics Energy storage, flexible power grids, 5G base stations, and other fields.

Qingdao Huaxin Wafer Third Generation Semiconductor Compound Wafer Substrate Project Capped

According to the latest news from China Construction Corporation, the third generation semiconductor compound wafer substrate project of Qingdao Huaxin wafers has been capped recently.

According to public information, this project is a key project in Qingdao City, located north of Kehai Road, south of Keyun Road, east of Planning East Line 22, and west of Huaguan Road in Qingdao High tech Zone. The construction area is 62000 square meters.

It is reported that the project will be started in February 2022, with a total investment of 700 million yuan. It uses silicon carbide, gallium nitride, Gallium(III) oxide and other third-generation semiconductor compound materials to process and produce related chip substrate products, which are widely used in optoelectronic devices and communication microwave RF devices (4G, 5G communication base stations). After the project is completed, it will achieve an annual production line of 330000 third-generation compound semiconductor substrate wafers.

High Core Zhongke Semiconductor Headquarters Project Signed in Wujiang, Suzhou

According to the Wujiang Development Zone, on June 8th, the 2023 Wujiang (Shanghai) Collaborative Development Investment Demonstration Conference will be held in Hongqiao, Shanghai. At the meeting, 53 projects were collectively signed with a total investment of 20.86 billion yuan. The contracted projects include the High Core Zhongke Semiconductor Headquarters project.

According to enterprise inspection information, Suzhou Gaoxin Zhongke Semiconductor Co., Ltd. was established on December 21, 2020. It is a semiconductor component reuse technology service provider, covering the recycling, classification, film removal, grinding, cleaning, and testing of abnormal wafer processes such as 12 inch, 8 inch, and 6 inch wafers, as well as precision component cleaning and reuse technology services for semiconductor and optoelectronic equipment, as well as high-level clean consumables manufacturing business.

Yuanxu Semiconductor Tianjin Production Base Project Commences

According to the news released by Binhai, on June 8, Yuanxu Semiconductor Tianjin Production Base Project officially started, which will create a model case of the third generation semiconductor chip Vertical integration manufacturing mode.

Yuanxu Semiconductor Tianjin Production Base Project is equipped with a new third-generation semiconductor optoelectronic chip research and development center and production line, integrating many important industrial chain links such as wafer materials, chip design, chip manufacturing, chip packaging and testing, and will focus on the Vertical integration manufacturing of the new generation Micro LED semiconductor integrated display. After completion, it will achieve an annual production scale of 30000 square meters of Mini/Micro LED display modules, with an annual production value of 1 billion yuan.

According to the official website, Yuanxu Semiconductor Technology Co., Ltd. (hereinafter referred to as "Yuanxu Semiconductor") was established in 2014. It is a science and technology innovation enterprise engaged in third-generation semiconductor chips, new displays, and visual solutions. There are currently 5 innovation research centers, 3 large production bases, and 6 regional operation centers in China.

The infrastructure project of the electronic chip research and development platform in Binhai High tech Zone has been fully capped

According to a report released by Binhai, recently, the infrastructure project of the electronic chip research and development platform in Binhai High tech Zone has fully capped its main structure. At present, the project construction has entered the stage of secondary structure and water and electricity installation construction.

The infrastructure project of electronic chip R&D platform in Binhai High tech Zone was started in September 2022 and is expected to be completed by the end of 2023. The project is a key project in Tianjin and one of the "New Infrastructure" projects in the "ten major projects" of building a beautiful "Binhai City". When completed, the project will become another important incubation platform for chip R&D enterprises in Binhai High tech Zone.

ZTE's standard 5G module will be launched on GAC, and the first equipped model is expected to be mass-produced next year

Recently, the Automotive Engineering Research Institute of Guangzhou Automobile Group Co., Ltd. (referred to as "GAC Research Institute") announced that the 5G V-Box mass production and development project will be the first to be equipped with a ZTE compliant 5G module. The first equipped model is expected to be mass-produced in 2024.

According to ZTE News, the ZTE vehicle grade 5G R16 module ZM9300 series used in this application is a domestic 5G module product based on a fully stack self-developed chip platform. The ZM9300 series products have reached industry leadership in terms of performance, bandwidth, latency, reliability, NR-V2X, AP high computing power, and high-precision positioning; In terms of quality, the module is designed in full compliance with the IATF16949:2016 standard, providing safe and reliable in car connectivity solutions for automotive industry customers. It can be widely used in car connectivity and other networking products (T-Box, OBU, RSU, cockpit, etc.).

It is reported that GAC Research Institute is one of the first automotive companies to independently develop T-Box and V-Box based on the R16 standard. ZTE Communications will fully leverage its information and communication technology advantages on the terminal and network sides, match GAC's layout in the field of intelligent driving technology research and development, and work together with GAC to achieve technological success and commercial success from the perspective of user scenarios and needs.

Recently, Liang Weiqiang, Vice President of GAC Research Institute, introduced that GAC has created a brand new scenario based functional experience based on the Starling architecture, including intelligent cockpit, intelligent driving, 5G interconnection, and ecological services. With a high starting point and strong scalability, it will bring a higher limit to intelligent vehicles.

Guanli Technology Industrialization Base Project Settled in Suzhou

According to a report released by Suzhou High tech Zone, on June 7th, the Guanli Industrialization Base project officially settled in Suzhou High tech Zone. This time, Guanli Technology continues to increase its capital and establish an industrial base that integrates research and development, production, sales, and other functions, which will further enhance the research and development production capacity of high-tech industries such as semiconductors and panels in the production process supply system.

Established in 2016, Suzhou Guanli Technology Co., Ltd. is a wholly-owned subsidiary of Pengyi Co., Ltd., a subsidiary of Taiwan, China Sunway, established in Suzhou High tech Zone, and has become a technologically leading enterprise in the field of production process supply system. Tianyancha shows that the company's business scope includes the manufacturing of specialized equipment for semiconductor devices; Special equipment manufacturing (excluding licensed professional equipment manufacturing); Manufacturing of electronic specialized equipment; Sales of specialized equipment for semiconductor devices; Sales of electronic specialized equipment, etc.

In addition, as an enterprise in Suzhou High tech Zone under Taiwan, China Sunway, Sunway Integration was successfully listed last year.

Laplace Semiconductor and Photovoltaic High end Equipment East China Regional Headquarters Project Settled in Wuxi

According to Huiju Xibei, on June 7th, the semiconductor and photovoltaic high-end equipment East China regional headquarters project was signed and settled in Xibei Town, Wuxi. This project is a research and development headquarters project invested by Laplace New Energy Technology Co., Ltd. (hereinafter referred to as "Laplace") in Xibei, mainly used for the construction of photovoltaic equipment research and development centers and semiconductor pilot lines.

According to public information, Laplace New Energy Technology Co., Ltd. was established in 2016 and is an enterprise founded by multiple high-end talents in the semiconductor equipment field at home and abroad. It is committed to becoming a leading domestic high-end equipment and solution provider in the semiconductor and photovoltaic fields.

It is reported that the Laplace technical team has developed the first high-capacity horizontal plug-in low-pressure diffusion oxidation furnace and vertical horizontal plug-in plasma enhanced vapor deposition equipment in the photovoltaic manufacturing field.

Annual production of 300000 semiconductor silicon wafers, laying the foundation for the Jiangsu Dongxu Electronics project

According to "Today Qingjiangpu", on June 6th, the foundation of the Jiangsu Dongxu Electronics project was laid.

The Jiangsu Dongxu Electronics Project plans to invest 300 million yuan and use 30 acres of land. After completion and operation, it can form an annual production capacity of 4 million electronic grade tapes, 300000 semiconductor silicon wafers, and 100 AOI visual inspection equipment, with an expected annual output value of 1 billion yuan.

According to the news, Shanghai Dongxu Electronic Technology Co., Ltd. (established by Japan's Dongxi Electronics Co., Ltd. in 2008) is a national high-tech enterprise with multiple invention patents. Its flagship product, electronic grade tape, is at a global leading level.

With a total investment of 330 million yuan, the International Automotive Chip Innovation Headquarters will start construction

According to Jiading, Shanghai, recently, the 22-10 plot project in Anting successfully acquired land. At the end of this year, the International Automotive Chip Innovation Headquarters will start construction on this plot. The total investment of the project is 330 million yuan, and it is expected to be completed in July 2025 and reach production by 2026.

The project extends to the base boundary in the east, Changji Road in the south, Moyu Road in the west, and the base boundary in the north. It is the location of the original "Yin'an Hotel" in Anting Town. The plot covers an area of nearly 7000 square meters, and a new commercial building with an area of over 30000 square meters will be built. After completion, it is planned to introduce more than 20 chip companies, with an expected annual operating income of no less than 440 million yuan and an annual tax payment of no less than 44 million yuan.

The International Automotive Chip Innovation Headquarters is an important layout for Anting to build a new highland of the automotive industry in the future. According to the news, up to now, Anting has landed nearly 20 chip projects such as Saishou Technology and Liqun Technology. It hopes to quickly gather leading enterprises, unicorn enterprises and growth oriented technology enterprises in the industry, as well as domestic and foreign automobile chip talents, and build an automobile chip industry ecosystem with advanced ideas, advanced technology, talent gathering, rich resources and distinctive characteristics through the completion and operation of the international automobile chip innovation headquarters.