Recently, the Second Session of the 16th Shanghai Municipal People's Congress opened at the World Expo Center, and Shanghai Mayor Gong Zheng delivered the Government Work Report (hereinafter referred to as the Report).

The report shows that in 2023, the total output value of strategic emerging industries in Shanghai's industrial sector accounted for 43.9% of the total output value of industries above designated size, and the scale of the three leading industries of integrated circuits, biopharmaceuticals, and artificial intelligence reached 1.6 trillion yuan. The R&D expenditure of the whole society accounts for about 4.4% of the city's GDP, and the number of high-value invention patents per 10000 people has increased to 50.2.

In 2024, Shanghai will further accelerate the construction of the "Five Centers" to enhance the city's level and core competitiveness. We will fully implement the new "Shanghai Plan" for integrated circuits, biopharmaceuticals, and artificial intelligence. Implement the "Intelligent Robot+" initiative and take the lead in carrying out pilot projects for national intelligent connected vehicle access and road use.

According to the "14th Five Year Plan" for the development of advanced manufacturing industry in Shanghai, Shanghai will play a leading role in the three leading industries of integrated circuits, biopharmaceuticals, and artificial intelligence.

In the field of integrated circuits, with a focus on independent innovation and scale development, we aim to enhance the level of the entire industry chain of chip design, manufacturing, packaging and testing, and equipment materials.

Chip design, accelerate breakthroughs in high-end processor chips, memory chips, microprocessor chips, image processor chips, field programmable gate array chips (FPGA), 5G core chips, etc. for cloud computing, data centers, next-generation communication, intelligent connected vehicles, artificial intelligence, Internet of Things and other fields, and promote the chip design capabilities of backbone enterprises to enter 3 nanometers and below, Build a national level electronic design automation (EDA) platform to support the formation of market competitiveness through new instruction sets, key core IPs, etc.

Manufacturing and testing, accelerating advanced process research and development, supporting the construction of 12 inch advanced process production lines and characteristic process production lines, striving for doubling production capacity, and accelerating the development of third-generation compound semiconductors; Develop advanced packaging technologies such as wafer level packaging, 2.5D/3D packaging, flexible substrate packaging, and system packaging.

Equipment materials, strengthen the innovation and development of equipment materials, break through the core process equipment of integrated circuits such as lithography equipment, etching equipment, thin film equipment, ion implantation equipment, wet process equipment, and detection equipment; Improve the production capacity and technical level of basic materials such as 12 inch silicon wafers, high-end mask boards, photoresists, wet chemicals, electronic special gases, and strengthen local supporting capabilities. Fully leverage the leading role of "1+4" innovation systems such as Zhangjiang Laboratory and National Integrated Circuit Innovation Center, strengthen forward-looking and disruptive technology research and development and layout, and collaborate with the Yangtze River Delta to carry out industrial chain cooperation. Accelerate the construction of characteristic industrial parks such as Shanghai Integrated Circuit Design Industrial Park, Dongfang Xingang, and Electronic Chemicals Special Zone, and introduce and construct a number of major projects. By 2025, we will basically build an integrated circuit innovation highland with independent development capabilities and global influence.